products catalogs of Baoji Zhipu

Tungsten heating elements :  Purity:99.95%

Density: 19.1g/cm3

Application temperature environment: ≤2400℃  Cooper base: Cu≥99.95%

Denisity: ≥8.8%

Application temperature environment: ≤1000℃

Product name: tungsten net heating element  Material grades: W1

Execution standard: GB3875-83  Product specifications: Ф0.3-Φ 4

The surface of the Tungsten Wire: bright surface  Tungsten wire mesh is composed of tungsten  preparation for ultra high temperature vacuum  annealing furnace.

Technological process:

W, Mo powder--pressed--sintered--forged--technological processing--finished products inspected—packaged—delivered

Seed crystal clip

A、Physical and chemical properties:

1、Purity: Mo≥99.95%、W≥99.95%;

2、Denisity: Mo≥10.2g/cm³、W≥19.2g/cm³;  3、Temperature environment: ≤2300℃;

4、Thermal expansivity(0—1600C):Mo:6×10-6、W:4.98×10-6  5、Yield strength: Mo(1600℃):50MPa、W(2080℃):25MPa;

6、Perfect recrystalization temperature:W 2050℃、Mo 1050℃.

B、Product dimensions and tolerances: seed crystal rod custom processing specific dimensions and tolerances according to customer's drawings.

More than long sapphire crystal furnace tungsten molybdenum parts according to the drawings of the technical requirements for the design and  manufacture, meet the requirements of customers, implement GB/T1804-200, GB1801-79, GB3875-83, GB8918-2006 and the company internal control  standard—inspection—packaging—delivery technology processing.

Ionization ion source is the neutral atoms or  molecules, and to extract ion beam device. It is various  kinds of ion accelerator, mass spectrometer,  electromagnetic isotope separator, ion implantation,  ion beam etching device, ion thruster and controlled  fusion device in the neutral beam injector equipment  such as indispensable components.

emiconductor epitaxy equipment tungsten molybdenum parts: GaNrefractory-MOCVD electronics, equipment set precision machinery, optics, chemistry, computing the multidisciplinary is  an organic whole, is a high degree of automation,  the price is expensive, high technology integration  of cutting-edge optoelectronic specialized  equipment, used for GaN epitaxial growth of semiconductor materials and the manufacture of  light-emitting diode (LED) chip. MOCVD equipment  dedicated tungsten, molybdenum parts: upper and  lower heat insulation piece, tungsten heater in middle, CLP plate, shutter valve insulation, cooling  and heat insulation board such as deep processing  products.

More information please kindly find in our website:

https://www.czpmow.com/